Elevate your production capabilities with our ultra-fast picosecond laser cutting workstation, designed specifically for flawless glass processing. Utilizing ultra-short pulse technology, this advanced system delivers crack-free edges, micron-level accuracy, and unmatched repeatability—perfect for high-volume manufacturing of displays, optics, and precision glass components.
Cold Ablation Processing: Near-zero thermal damage for brittle/heat-sensitive materials
Universal Material Compatibility: Handles glass, ceramics, polymers, and thin metals
Submicron Precision: Minimal edge chipping and micron-level feature definition
High-Power CO2 Laser
Controlled Fracturing: Clean splitting of pre-scored materials (e.g., glass, quartz)
Adaptive Power Modulation: Adjustable for diverse material thicknesses
High-Dynamics Positioning: Linear motor-driven stages with submicron repeatability
Machine Vision Integration: Automatic alignment and defect detection
User-Friendly Software: Material-specific presets and real-time process monitoring
Low-Maintenance Design: Modular components for quick servicing
Medical: Brittle material structuring for implants/devices
Advanced Materials: Composite processing and transparent material drilling
| Model: HT-CP60-C180 | |||
| Laser source | Laser light source | Picosecond infrared laser | CO2 laser |
| Laser wavelength | 1060nm | 10.6μm | |
| Average output | 60W | 180W | |
| Laser power | 60W (30/80W) | 180W (80W/100W/120W) | |
| Pulse train energy | ≥1.2mJ @50kHz | ||
| Pulse Width | <15ps | ||
| Processing performance | |||
| Cutting speed | <900mm/s | ||
| Working area | 600×800mm | ||
| Cutting thickness | <20mm | ||
| Repeatability accuracy | ±2μm | ||
| Positioning accuracy | ±3μm | ||
| Environmental conditions for use | |||
| Machine dimension | 2500×2500×2000mm | ||
| Software System | Independently developed cutting and splitting processing system | ||
| Power supply | 220V/50Hz/6kW | ||
| Cooling method | Water Cooling | ||
| Environmental requirements | 20-35℃ | ||
